Capabilities

Along with all the standard features of the TTI RX, BYU's has an integrated PIN axis, Linear AFSD capabilities, and advanced temperature control programs.

BYU's Bond machine has be optimized for research capacities, with an extended C-frame this machine can create some of the fastest RFSSW welds in the world.

The new welding technology complements the existing VTC-300C machine platform, which delivers a standard 15,000-rpm, 30-hp, 40-taper spindle capable of handling a wide variety of metalcutting applications. Additionally, the machine and waycover design has been enhanced to provide 1,574 ipm rapid feedrates on all axes. Its fixed 78.74" x 30" table provides process flexibility for a wide range of applications, while an optional center partition can divide the machine’s work envelope into two separate work zones to allow the machine to be in cycle in one area while loading, unloading or setting up a part in the other. The machine’s axis travels measure 65.35" in X, 30" in Y and 25.6" in Z.

Newly developed imaging engine with 4K CMOS image sensor, high NA (.9,) HR lens and motorized revolver. Magnify from 20x - 6,000x without manually changing lenses. Create high-resolution images of the smallest surface differences. One-click elemental analysis, no sample preparation or vacuum required, automatic material identification.

Various Tensile testers; 1kip Mini, 3kip Acumen, 20kip 809 A/T, 100kip Landmark . Tensile tester for tensile and compressive loads. Frame Capacity ranging from 1,000 lb to 110,000 lb (+/- 10 lb.) As well as the AOX (MTS Advantage Optical Extensometer.)

Optical microscopes are capable of capturing digital images, measuring and analysis. Olympus GX51 Inverted Microscope (up to 200x magnification.) Olympus SZX12 Stereo Microscope (up to 90x magnification

Micro Hardness Testers utilize advanced technology for incredibly accurate test results in evaluating the hardness of surface at different points across a sample.

The MELD machine allows for Additive Friction Stir Deposition (AFSD) to be performed at BYU in 3D. This machine specializes in Solid State metal 3S printing in open air environment for a variety of metals: aluminum, steel, stainless steel, magnesium, copper, titanium, etc. Allowing for both print, repair, joining, and cladding for metal parts. The BYU MELD machine is enabled with the MELD temperature control technology and algorithm upgrade allowing for temperature-controlled depositions.
Table Size: 51in x 23in
Build Volume: 45in X 23in X 23in
Control type: RPM Control and Temperature Control
Material type: solid metal bar
Environment: Open Atmosphere
Build Material: Aluminum, Steel, Stainless Steel, Magnesium, copper, titanium, etc.

Dual Beam FIBs are a type of instrumentation that consist of a high-resolution SEM column with a fine-probe ion source (Focused Ion Beam). The Helios NanoLab™ 600 is equipped with a high resolution Elstar™ electron column with a Field Emission Gun (FEG) electron source. It is capable of imaging with a resolution better than 1 nm @ 15 kV and 2.5 nm at 1 kV beam energies. The Gallium ion beam (Tomahawk™ ion column) can image and remove material down to 5nm resolution levels. This instrument is capable of preparing S/TEM specimens from specific areas of a sample as well as nano-machining and 3-D imaging. Adding to the imaging and sputtering capabilities are a SDD XEDS detector and an electron backscatter diffraction detector for orientation imaging. Also available is an OmniProbe AutoProbe™ 200 in-situ sample lift-out system allowing for the preparation of site specific TEM samples without the need for support films.

The VeriosTM is the second generation of ThermoScientific’s leading XHR SEM family, offering: Best-in-class ElstarTM Schottky Monochromated (UC) FESEM technology Sub-nanometer resolution from 1 to 30 keV UC gun (monochromator), Constant PowerTM lens technology and electrostatic scanning for accurate and stable imaging consistent measurement results with the ability to calibrate to a NIST certified standard at high magnification Beam landing energies as low as 20 eV with very high resolution for true surface characterization High-sensitivity, in-column & below-the-lens detectors very high precision & stability, piezo-driven 100x100 mm stage in a large analytical chamber

The Tecnai G² F20 microscope is a high performance 200kV scanning transmission electron microscope that offers: The patented U-TWIN objective lens enables high performance S/TEM imaging with sub nanometer spatial resolution, High spatial coherence and high brightness due to an ultra-stable FEI Schottky source, State-of-the-art, superior stability, high-tension circuitry resulting in an energy spread of less than 0.7 eV Computerized stage with unique eucentric specification for maximum stability accessories include: Slow-scan CCD cameras, High-angle annular dark-field detector (HAADF) for STEMX-ray energy-dispersive spectrometer (XEDS)Parallel electron energy-loss spectrometer (PEELS)In-column Monochromator for energy-filtered imaging (EFTEM)

The Apreo C Low-Vac SEM is a versatile, high-performance instrument with both low vacuum and high vacuum modes to accommodate a wide range of samples. Characterization of conductive and non-conductive samples with SE and BSE imaging is possible in both modes of operation. Sample preparation is minimized due to the low vacuum capability to reduce charging of non-conductive and/or hydrated specimens. In addition, the field emission gun (FEG) system allows for the high-resolution imaging that is expected of a high vacuum field-emission SEM. The Apreois also equipped with an energy dispersive spectrometer (XEDS) for chemical analysis and an EBSD system for crystallographic or diffraction analysis.