BYU Capabilities

The Apreo C Low-Vac SEM is a versatile, high-performance instrument with both low vacuum and high vacuum modes to accommodate a wide range of samples. Characterization of conductive and non-conductive samples with SE and BSE imaging is possible in both modes of operation. Sample preparation is minimized due to the low vacuum capability to reduce charging of non-conductive and/or hydrated specimens. In addition, the field emission gun (FEG) system allows for the high-resolution imaging that is expected of a high vacuum field-emission SEM. The Apreois also equipped with an energy dispersive spectrometer (XEDS) for chemical analysis and an EBSD system for crystallographic or diffraction analysis.

BYU's Bond machine has be optimized for research capacities, with an extended C-frame this machine can create some of the fastest RFSSW welds in the world.

Dual Beam Focused Ion Beam (FIB) systems combine a high-resolution scanning electron microscope (SEM) with a focused ion beam, allowing both imaging and precise material modification at the nanoscale. The Helios NanoLab™ 600 used in this work includes an Elstar™ electron column with a field emission gun (FEG), achieving resolutions better than 1 nm at 15 kV and around 2.5 nm at 1 kV. The system also incorporates a Gallium-based ion column (Tomahawk™), which enables imaging and material removal down to approximately 5 nm resolution.
This setup is particularly useful for preparing site-specific S/TEM specimens, nanoscale milling, and three-dimensional reconstruction. It also includes detectors for elemental and crystallographic analysis, such as a silicon drift detector (SDD) for X-ray energy dispersive spectroscopy (XEDS) and an electron backscatter diffraction (EBSD) system. An in-situ lift-out tool (OmniProbe AutoProbe™ 200) allows for the direct extraction of TEM lamellae from targeted regions without the need for support films.

Newly developed imaging engine with 4K CMOS image sensor, high NA (.9,) HR lens and motorized revolver. Magnify from 20x - 6,000x without manually changing lenses. Create high-resolution images of the smallest surface differences. One-click elemental analysis, no sample preparation or vacuum required, automatic material identification.

The new welding technology complements the existing VTC-300C machine platform, which delivers a standard 15,000-rpm, 30-hp, 40-taper spindle capable of handling a wide variety of metalcutting applications. Additionally, the machine and waycover design has been enhanced to provide 1,574 ipm rapid feedrates on all axes. Its fixed 78.74" x 30" table provides process flexibility for a wide range of applications, while an optional center partition can divide the machine’s work envelope into two separate work zones to allow the machine to be in cycle in one area while loading, unloading or setting up a part in the other. The machine’s axis travels measure 65.35" in X, 30" in Y and 25.6" in Z.

The MELD machine allows for Additive Friction Stir Deposition (AFSD) to be performed at BYU in 3D. This machine specializes in Solid State metal 3S printing in open air environment for a variety of metals: aluminum, steel, stainless steel, magnesium, copper, titanium, etc. Allowing for both print, repair, joining, and cladding for metal parts. The BYU MELD machine is enabled with the MELD temperature control technology and algorithm upgrade allowing for temperature-controlled depositions.
Table Size: 51in x 23in
Build Volume: 45in X 23in X 23in
Control type: RPM Control and Temperature Control
Material type: solid metal bar
Environment: Open Atmosphere
Build Material: Aluminum, Steel, Stainless Steel, Magnesium, copper, titanium, etc.

Micro Hardness Testers utilize advanced technology for incredibly accurate test results in evaluating the hardness of surface at different points across a sample.

Optical microscopes are capable of capturing digital images, measuring and analysis. Olympus GX51 Inverted Microscope (up to 200x magnification.) Olympus SZX12 Stereo Microscope (up to 90x magnification

The Tecnai G² F20 microscope is a high performance 200kV scanning transmission electron microscope that offers: The patented U-TWIN objective lens enables high performance S/TEM imaging with sub nanometer spatial resolution, High spatial coherence and high brightness due to an ultra-stable FEI Schottky source, State-of-the-art, superior stability, high-tension circuitry resulting in an energy spread of less than 0.7 eV Computerized stage with unique eucentric specification for maximum stability accessories include: Slow-scan CCD cameras, High-angle annular dark-field detector (HAADF) for STEMX-ray energy-dispersive spectrometer (XEDS)Parallel electron energy-loss spectrometer (PEELS)In-column Monochromator for energy-filtered imaging (EFTEM)

Various Tensile testers; 1kip Mini, 3kip Acumen, 20kip 809 A/T, 100kip Landmark . Tensile tester for tensile and compressive loads. Frame Capacity ranging from 1,000 lb to 110,000 lb (+/- 10 lb.) As well as the AOX (MTS Advantage Optical Extensometer.)

Along with all the standard features of the TTI RX, BYU's has an integrated PIN axis, Linear AFSD capabilities, and advanced temperature control programs.

The VeriosTM is the second generation of ThermoScientific’s leading XHR SEM family, offering: Best-in-class ElstarTM Schottky Monochromated (UC) FESEM technology Sub-nanometer resolution from 1 to 30 keV UC gun (monochromator), Constant PowerTM lens technology and electrostatic scanning for accurate and stable imaging consistent measurement results with the ability to calibrate to a NIST certified standard at high magnification Beam landing energies as low as 20 eV with very high resolution for true surface characterization High-sensitivity, in-column & below-the-lens detectors very high precision & stability, piezo-driven 100x100 mm stage in a large analytical chamber

The Keyence VR-6000 Series 3D Optical Profilometer is a high-precision, non-contact measurement system designed for rapid and detailed surface analysis. It captures full surface data with 0.1 µm resolution in just one second, making it ideal for inspecting intricate components such as medical devices, turbine blades, and circuit boards.
Equipped with a motorized rotational scanning mechanism, the VR-6000 eliminates blind spots, allowing for comprehensive measurements of complex geometries without the need for physical contact. Its HDR scanning algorithm adapts to various materials, including glossy and matte surfaces, ensuring accurate data capture across a wide range of applications.
This versatile profilometer consolidates multiple measurement functions into a single device, enabling users to perform 3D profiling, surface roughness analysis, and dimensional measurements efficiently. Its intuitive operation and rapid data acquisition capabilities enhance productivity in quality control, prototyping, and manufacturing environments.

The Keyence VL-800 Series 3D Scanner CMM is a high-precision, non-contact metrology system that combines structured light scanning with advanced AI-guided tools to deliver efficient and reliable 3D measurement results. It offers a repeatability of 2 μm and a measurement accuracy of ±10 μm, making it suitable for highly detailed inspections. A key feature of the VL-800 is its 360° motorized rotary stage, which allows for complete circumferential scanning of objects without the need for manual repositioning—ideal for capturing complex or hidden geometries. The system also supports direct comparison of scanned data against CAD models, enabling fast identification of dimensional deviations. Integrated AI capabilities automatically suggest the most appropriate measurement tools based on part geometry, streamlining workflow even for less experienced users. Additionally, the VL-800 can generate STEP models from scanned parts, supporting reverse engineering and rapid prototyping. It also offers advanced features such as virtual cross-sectioning and 12 types of GD&T (Geometric Dimensioning and Tolerancing) analysis, making it a powerful tool for quality control, product development, and manufacturing applications.